HR-TSF
HR-TSF ultra-fast thermal shock · Rapid Temperature Change
Transfer ≤5 s · a common choice for wafer-level screening
| Model | HR-TSF |
|---|---|
| Configuration | Ultra-fast thermal shock |
| Key specification | See datasheet |
| Compliance | GB/T 5170, IEC 60068, GJB 150A |
Key features
- High-precision temperature control, stability ±0.5 °C
- Stainless-steel interior with corrosion-resistant finish
- Touch-screen controller with editable test profiles
- Layered safety: over-temperature, earth leakage and phase-loss protection
Configuration, temperature range, internal volume and interfaces can all be modified. Tell us your test standard and specimen size and we will confirm the right build.
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